Home / Products / Capacitors / Mica and PTFE Capacitors
Mica and PTFE Capacitors
| Image | Part Number | Description | Manufacturer | Quick Order |
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0199000044 | HF MINI POWER KIT | Fair-Rite Products Corp. | |
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0199000043 | FLEX FERRITE KIT43 | Fair-Rite Products Corp. | |
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0199000041 | 75 MATERIAL SNAP-IT KIT | Fair-Rite Products Corp. | |
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0199000039 | HI FREQ TOROID KIT | Fair-Rite Products Corp. | |
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0199000036 | MULTI-APERTURE CORE KIT 36 | Fair-Rite Products Corp. | |
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0199000033 | 61 MATL SNAP-IT KIT 34 | Fair-Rite Products Corp. | |
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0199000031 | 43 MATL SNAP-IT KIT 34 | Fair-Rite Products Corp. | |
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0199000030 | 31 MATL SNAP-IT KIT 34 | Fair-Rite Products Corp. | |
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0199000025 | SMBEAD KIT 25 | Fair-Rite Products Corp. | |
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0199000019 | SHIELD BEAD KIT 19 | Fair-Rite Products Corp. | |
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0199000018 | CHIP BEAD KIT 18 | Fair-Rite Products Corp. | |
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B82733X0001 | KIT CHOKE POWER LINE FRAME CORE | EPCOS (TDK) | |
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B82732X0001 | KIT CHOKE POWER LINE FRAME CORE | EPCOS (TDK) | |
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B82731X0001 | KIT CHOKE POWER LINE D-CORE | EPCOS (TDK) | |
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B82723X001 | CHOKE DOUBLE | EPCOS (TDK) | |
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B82721X0001 | KIT CHOKE POWER LINE RING CORE | EPCOS (TDK) | |
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B39000Z3410A004 | SAMPLE KIT FOR WIRELESS AMI | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | |
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B39000Z3410A003 | SAMPLE KIT FOR WIRELESS AMI | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | |
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B39000Z3410A002 | SAMPLE KIT FOR WIRELESS AMI | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | |
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EMINLKIT | KIT EMI | Pulse Electronics Power | |
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B82731X0002 | KIT CHOKE POWER LINE E-CORE | EPCOS (TDK) | |
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0199000005 | EXPANDED CBLSUPPRESSOR KIT 5 | Fair-Rite Products Corp. | |
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0199000017 | 17 SNAP IT KIT | Fair-Rite Products Corp. | |
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0199000027 | WOUND BEAD KIT 27 | Fair-Rite Products Corp. | |
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0199000028 | BEAD-ON-LEAD KIT 28 | Fair-Rite Products Corp. | |
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0199000032 | 46 MATL CORES SNAP-ITS KIT | Fair-Rite Products Corp. | |
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0199000034 | EXPANDED SNAP-IT KIT 34 | Fair-Rite Products Corp. | |
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0199000038 | FLAT CABLE CORE KIT | Fair-Rite Products Corp. | |
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B82722X0001 | VARISTOR | EPCOS (TDK) | |
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BMBLABKIT | BMB BEADS LAB KIT | TE Connectivity Passive Product | |
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742722 | FLAT FERRITE CORES WE-FLAT | Wurth Electronics Inc. | |
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4310-900 | PRESS-IN EMI/RFI FILTER KIT | Tusonix a Subsidiary of CTS Electronic Components | |
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EK28B27SB | ENGINEERING KIT - SADDLE BEADS F | Leader Tech Inc. | |
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B39000Z3410A001 | SAMPLE KIT FOR WIRELESS AMI | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | |
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B82789X001 | KIT CHOKE DATALINE B82789 SERIES | EPCOS (TDK) | |
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B82793X001 | KIT CHOKE DATALINE B82793 SERIES | EPCOS (TDK) | |
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B82793X1 | KIT CHOKE DATALINE B82793 SERIES | EPCOS (TDK) | |
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EKEMBL18F | KIT FER CHIP BLM 0603 1206 1806 | Murata Electronics North America | |
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K-C02 | KIT COMMON MODE CHOKES | Laird-Signal Integrity Products | |
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K-C40 | KIT EMI RIBBON FLEX BEAD CORE | Laird-Signal Integrity Products | |
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MHBEAD-LAB1 | KIT FERR CHIP BEAD MH SERIES | Bourns Inc. | |
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MTBEAD-LAB1 | KIT FERR CHIP BEAD MT SERIES | Bourns Inc. | |
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MUBEAD-LAB1 | KIT FERR CHIP BEAD MG MU MZ | Bourns Inc. |