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| Part Number | HF115AC-0.0055-AC-90 |
| Datasheet | HF115AC-0.0055-AC-90 datasheet |
| Description | THERM PAD 21.84MMX18.79MM W/ADH |
| Manufacturer | Bergquist |
| Series | Hi-Flow® 115-AC |
| Part Status | Active |
| Usage | TO-218, TO-220, TO-247 |
| Type | Pad, Sheet |
| Shape | Rectangular |
| Outline | 21.84mm x 18.79mm |
| Thickness | 0.0055" (0.140mm) |
| Material | Phase Change Compound |
| Adhesive | Adhesive - One Side |
| Backing, Carrier | Fiberglass |
| Color | Gray |
| Thermal Resistivity | 0.35°C/W |
| Thermal Conductivity | 0.8 W/m-K |