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| Part Number | APF19-19-13CB |
| Datasheet | APF19-19-13CB datasheet |
| Description | HEATSINK LOW-PROFILE FORGED |
| Manufacturer | CTS Thermal Management Products |
| Series | APF |
| Part Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square, Fins |
| Length | 0.748" (19.00mm) |
| Width | 0.748" (19.00mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |