Home / Products / Prototyping, Fabrication Products / Adapter, Breakout Boards / PA0170
Product Introduction
PA0170
- Part Number
- PA0170
- Manufacturer/Brand
- Chip Quik Inc.
- Description
- MINI SOIC-8 EXP PAD TO DIP-8 SMT
- Category
- Adapter, Breakout Boards
- RoHs Status
- Lead free / RoHS Compliant
- Series
- Proto-Advantage
- Quantity
- 5975pcs Stock Available.
Images are for reference only
See Product Specifications
See Product Specifications
Product Specifications
| Part Number | PA0170 |
| Datasheet | PA0170 datasheet |
| Description | MINI SOIC-8 EXP PAD TO DIP-8 SMT |
| Manufacturer | Chip Quik Inc. |
| Series | Proto-Advantage |
| Part Status | Active |
| Proto Board Type | SMD to DIP |
| Package Accepted | MiniSOIC EP |
| Number of Positions | 8 |
| Pitch | 0.026" (0.65mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 0.400" (17.78mm x 10.16mm) |
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