Home / Products / Fans, Thermal Management / Thermal - Pads, Sheets / HF115AC-0.0055-AC-105
Part Number | HF115AC-0.0055-AC-105 |
Datasheet | HF115AC-0.0055-AC-105 datasheet |
Description | THERM PAD 36.83MMX21.29MM W/ADH |
Manufacturer | Bergquist |
Series | Hi-Flow® 115-AC |
Part Status | Active |
Usage | SIP |
Type | Pad, Sheet |
Shape | Rectangular |
Outline | 36.83mm x 21.29mm |
Thickness | 0.0055" (0.140mm) |
Material | Phase Change Compound |
Adhesive | Adhesive - One Side |
Backing, Carrier | Fiberglass |
Color | Gray |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 0.8 W/m-K |