Home / Products / RF/IF and RFID / RFI and EMI - Contacts, Fingerstock and Gaskets / 67SLG060080070PI00
Product Introduction
67SLG060080070PI00
- Part Number
- 67SLG060080070PI00
- Manufacturer/Brand
- Laird Technologies EMI
- Description
- METAL FILM OVER FOAM CONTACTS
- RoHs Status
- Lead free / RoHS Compliant
- Series
- SMD Grounding Metallized
- Quantity
- 2068pcs Stock Available.
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See Product Specifications
See Product Specifications
Product Specifications
| Part Number | 67SLG060080070PI00 |
| Datasheet | 67SLG060080070PI00 datasheet |
| Description | METAL FILM OVER FOAM CONTACTS |
| Manufacturer | Laird Technologies EMI |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Type | Film Over Foam |
| Shape | Rectangle |
| Width | 0.236" (6.00mm) |
| Length | 0.276" (7.00mm) |
| Height | 0.315" (8.00mm) |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Plating | - |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | -40°C ~ 70°C |
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