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Part Number | APF30-30-10CB |
Datasheet | APF30-30-10CB datasheet |
Description | HEATSINK LOW-PROFILE FORGED |
Manufacturer | CTS Thermal Management Products |
Series | APF |
Part Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Shape | Square, Fins |
Length | 1.181" (30.00mm) |
Width | 1.181" (30.00mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.370" (9.40mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 3.30°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Material | Aluminum |
Material Finish | Black Anodized |