
Home / Products / Connectors, Interconnects / Sockets for ICs, Transistors / DILB20P-223TLF

| Part Number | DILB20P-223TLF |
| Datasheet | DILB20P-223TLF datasheet |
| Description | CONN IC DIP SOCKET 20POS TIN |
| Manufacturer | Amphenol ICC (FCI) |
| Series | - |
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 20 (2 x 10) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Polyamide (PA), Nylon |
| Operating Temperature | -55°C ~ 105°C |