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Product Introduction
1354298
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Product Specifications
| Part Number | 1354298 |
| Datasheet | 1354298 datasheet |
| Description | 63S4 WS200 ACP 500G JAR |
| Manufacturer | Multicore |
| Series | WS200™ |
| Part Status | Not For New Designs |
| Type | Solder Paste |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Melting Point | 361°F (183°C) |
| Flux Type | Water Soluble |
| Wire Gauge | - |
| Process | Leaded |
| Form | Jar, 17.64 oz (500g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
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