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Part Number | 524-AG11D |
Description | CONN IC DIP SOCKET 24POS GOLD |
Manufacturer | TE Connectivity AMP Connectors |
Series | 500 |
Part Status | Active |
Type | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | - |
Contact Finish Thickness - Post | - |
Contact Material - Post | Brass |
Housing Material | Polyester |
Operating Temperature | -55°C ~ 125°C |