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Part Number | TS391SNL |
Datasheet | TS391SNL datasheet |
Description | THERMALLY STABLE SOLDER PASTE NO |
Manufacturer | Chip Quik Inc. |
Series | - |
Part Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Process | Lead Free |
Form | Syringe, 0.53 oz (15g), 5cc |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |