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Product Introduction

TS391SNL

Part Number
TS391SNL
Manufacturer/Brand
Chip Quik Inc.
Description
THERMALLY STABLE SOLDER PASTE NO
Category
Solder
RoHs Status
Lead free / RoHS Compliant
Series
-
Quantity
297pcs Stock Available.

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Product Specifications

Part Number TS391SNL
Datasheet TS391SNL datasheet
Description THERMALLY STABLE SOLDER PASTE NO
Manufacturer Chip Quik Inc.
Series -
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process Lead Free
Form Syringe, 0.53 oz (15g), 5cc
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)

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