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| Part Number | LTN20069 |
| Datasheet | LTN20069 datasheet |
| Description | HEAT SINK BGA/PGA 16.5X16.5X8.9 |
| Manufacturer | Wakefield-Vette |
| Series | Penguin |
| Part Status | Active |
| Type | Board Level |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Fins |
| Length | 0.650" (16.51mm) |
| Width | 0.653" (16.59mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.350" (8.89mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |