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| Part Number | SMDLTLFP500T3C |
| Datasheet | SMDLTLFP500T3C datasheet |
| Description | SOLDER PASTE LOW TEMP T3 500G |
| Manufacturer | Chip Quik Inc. |
| Series | - |
| Part Status | Active |
| Type | Solder Paste |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter | - |
| Melting Point | 281°F (138°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Process | Lead Free |
| Form | Cartridge, 17.64 oz (500g) |
| Shelf Life | 6 Months, 2 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |