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Part Number | SMDLTLFP500T3C |
Datasheet | SMDLTLFP500T3C datasheet |
Description | SOLDER PASTE LOW TEMP T3 500G |
Manufacturer | Chip Quik Inc. |
Series | - |
Part Status | Active |
Type | Solder Paste |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Melting Point | 281°F (138°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Process | Lead Free |
Form | Cartridge, 17.64 oz (500g) |
Shelf Life | 6 Months, 2 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |