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Part Number | 67SLG050060050PI00 |
Datasheet | 67SLG050060050PI00 datasheet |
Description | METAL FILM OVER FOAM CONTACTS |
Manufacturer | Laird Technologies EMI |
Series | SMD Grounding Metallized |
Part Status | Active |
Type | Film Over Foam |
Shape | Rectangle |
Width | 0.197" (5.00mm) |
Length | 0.197" (5.00mm) |
Height | 0.236" (6.00mm) |
Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
Plating | - |
Plating - Thickness | - |
Attachment Method | Solder |
Operating Temperature | -40°C ~ 70°C |