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Part Number | 558-10-500M30-001104 |
Datasheet | 558-10-500M30-001104 datasheet |
Description | BGA SURFACE MOUNT 1.27MM |
Manufacturer | Preci-Dip |
Series | 558 |
Part Status | Active |
Type | BGA |
Number of Positions or Pins (Grid) | 500 (30 x 30) |
Pitch - Mating | 0.050" (1.27mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Brass |
Mounting Type | Surface Mount |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.050" (1.27mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Material - Post | Brass |
Housing Material | FR4 Epoxy Glass |
Operating Temperature | -55°C ~ 125°C |