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| Part Number | 50-02-0584-0029 |
| Datasheet | 50-02-0584-0029 datasheet |
| Description | 2.5G AG/EPOXY CHO-PAK |
| Manufacturer | Parker Chomerics |
| Series | CHO-BOND® 584-29 |
| Part Status | Active |
| Type | Epoxy, 2 Part |
| Features | Conductive, Silver |
| For Use With/Related Products | Sealing Electronic Components |