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Product Introduction
TS391SNL250
- Part Number
- TS391SNL250
- Manufacturer/Brand
- Chip Quik Inc.
- Description
- THERMALLY STABLE SOLDER PASTE NO
- Category
- Solder
- RoHs Status
- Lead free / RoHS Compliant
- Series
- -
- Quantity
- 168pcs Stock Available.
Images are for reference only
See Product Specifications
See Product Specifications
Product Specifications
| Part Number | TS391SNL250 |
| Datasheet | TS391SNL250 datasheet |
| Description | THERMALLY STABLE SOLDER PASTE NO |
| Manufacturer | Chip Quik Inc. |
| Series | - |
| Part Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Process | Lead Free |
| Form | Jar, 8.8 oz (250g) |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
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