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Part Number | ICF-318-T-O |
Datasheet | ICF-318-T-O datasheet |
Description | CONN IC DIP SOCKET 18POS TIN |
Manufacturer | Samtec Inc. |
Series | iCF |
Part Status | Active |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 18 (2 x 9) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin |
Contact Finish Thickness - Mating | - |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Surface Mount |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | - |
Contact Material - Post | Beryllium Copper |
Housing Material | Liquid Crystal Polymer (LCP) |
Operating Temperature | -55°C ~ 125°C |