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Part Number | 40-526-11 |
Datasheet | 40-526-11 datasheet |
Description | CONN IC DIP SOCKET ZIF 40POS GLD |
Manufacturer | Aries Electronics |
Series | Lo-PRO®file, 526 |
Part Status | Active |
Type | DIP, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature | -55°C ~ 125°C |