Home / Products / Fans, Thermal Management / Thermal - Adhesives, Epoxies, Greases, Pastes / TC1-200G
Product Introduction
TC1-200G
- Part Number
- TC1-200G
- Manufacturer/Brand
- Chip Quik Inc.
- Description
- HEAT SINK COMPOUND - HIGH DENSIT
- RoHs Status
- Lead free / RoHS Compliant
- Series
- -
- Quantity
- 199pcs Stock Available.
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See Product Specifications
See Product Specifications
Product Specifications
| Part Number | TC1-200G |
| Description | HEAT SINK COMPOUND - HIGH DENSIT |
| Manufacturer | Chip Quik Inc. |
| Series | - |
| Part Status | Active |
| Type | Silicone Compound |
| Size / Dimension | 200 gram Jar |
| Usable Temperature Range | - |
| Color | White |
| Thermal Conductivity | 0.67 W/m-K |
| Features | - |
| Shelf Life | 60 Months |
| Storage/Refrigeration | 37°F ~ 77°F (3°C ~ 25°C) |
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