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Part Number | BDN09-3CB |
Description | HEATSINK CPU .91 SQ |
Manufacturer | CTS Thermal Management Products |
Series | BDN |
Part Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Shape | Square, Pin Fins |
Length | 0.910" (23.11mm) |
Width | 0.910" (23.11mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.355" (9.02mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
Thermal Resistance @ Natural | 26.90°C/W |
Material | Aluminum |
Material Finish | Black Anodized |