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| Part Number | TS391LT |
| Datasheet | TS391LT datasheet |
| Description | THERMALLY STABLE SOLDER PASTE NO |
| Manufacturer | Chip Quik Inc. |
| Series | - |
| Part Status | Active |
| Type | Solder Paste |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter | - |
| Melting Point | 281°F (138°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Process | Lead Free |
| Form | Syringe, 0.53 oz (15g), 5cc |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |