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Part Number | V-1102-SMD/A-L |
Datasheet | V-1102-SMD/A-L datasheet |
Description | HEATSINK TO-263 19.38X25.40MM |
Manufacturer | Assmann WSW Components |
Series | - |
Part Status | Active |
Type | Top Mount |
Package Cooled | TO-263 (D²Pak) |
Attachment Method | SMD Pad |
Shape | Rectangular, Fins |
Length | 0.763" (19.38mm) |
Width | 1.000" (25.40mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | - |
Thermal Resistance @ Natural | 23.00°C/W |
Material | Copper |
Material Finish | Tin |