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| Part Number | 655-53AB |
| Datasheet | 655-53AB datasheet |
| Description | HEATSINK CPU 40.6MM SQ H.525 |
| Manufacturer | Wakefield-Vette |
| Series | 655 |
| Part Status | Active |
| Type | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square, Pin Fins |
| Length | 1.600" (40.64mm) |
| Width | 1.600" (40.64mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.522" (13.27mm) |
| Power Dissipation @ Temperature Rise | 4.0W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 2.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |