Home / Products / Connectors, Interconnects / Sockets for ICs, Transistors / 40-6554-18
Part Number | 40-6554-18 |
Datasheet | 40-6554-18 datasheet |
Description | CONN IC DIP SOCKET ZIF 40POS |
Manufacturer | Aries Electronics |
Series | 55 |
Part Status | Active |
Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Nickel Boron |
Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
Contact Material - Mating | Beryllium Nickel |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Nickel Boron |
Contact Finish Thickness - Post | 50.0µin (1.27µm) |
Contact Material - Post | Beryllium Nickel |
Housing Material | Polyetheretherketone (PEEK), Glass Filled |
Operating Temperature | -55°C ~ 250°C |