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Part Number | 30-3513-11H |
Datasheet | 30-3513-11H datasheet |
Description | CONN IC DIP SOCKET 30POS GOLD |
Manufacturer | Aries Electronics |
Series | Lo-PRO®file, 513 |
Part Status | Active |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 30 (2 x 15) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Material - Post | Brass |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature | -55°C ~ 105°C |