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Home / Products / Connectors, Interconnects / Sockets for ICs, Transistors / DIP318-011BLF
Part Number | DIP318-011BLF |
Datasheet | DIP318-011BLF datasheet |
Description | CONN IC DIP SOCKET 18POS GOLD |
Manufacturer | Amphenol ICC (FCI) |
Series | - |
Part Status | Obsolete |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 18 (2 x 9) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 200.0µin (5.08µm) |
Contact Material - Post | Brass |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature | - |