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Part Number | 28-3552-11 |
Datasheet | 28-3552-11 datasheet |
Description | CONN IC DIP SOCKET ZIF 28POS GLD |
Manufacturer | Aries Electronics |
Series | 55 |
Part Status | Active |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | - |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | - |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature | - |