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Part Number | BU400Z-178-HT |
Datasheet | BU400Z-178-HT datasheet |
Description | CONN IC DIP SOCKET 40POS GOLD |
Manufacturer | On Shore Technology Inc. |
Series | BU-178HT |
Part Status | Active |
Type | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 78.7µin (2.00µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Surface Mount |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Copper |
Contact Finish Thickness - Post | Flash |
Contact Material - Post | Brass |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature | -55°C ~ 125°C |